By Rao Tummala
System-on-Package (SOP) is an rising microelectronic expertise that locations a complete process on a unmarried chip-size package deal. the place “systems” was cumbersome bins housing countless numbers of parts, SOP saves interconnection time and warmth iteration by means of retain an entire method with computing, communications, and client features all in one chip. Written by means of the Georgia Tech builders of the expertise, this booklet explains the elemental parameters, layout features, and production concerns, displaying digital designers how this radical new packaging expertise can be utilized to resolve urgent electronics layout demanding situations.
Read or Download System on Package: Miniaturization of the Entire System PDF
Similar semiconductors books
Realize the right way to release and be successful as a Fabless Semiconductor company Fabless Semiconductor Implementation takes you step by step in the course of the demanding situations confronted by means of fabless organisations within the improvement of built-in circuits. This specialist consultant examines the capability pitfalls of IC implementation within the swiftly starting to be fabless phase of the semiconductor and elaborates tips on how to triumph over those problems.
Overlaying the necessities of analog circuit layout, this ebook takes a different layout strategy according to a MOSFET version legitimate for all working areas, instead of the normal square-law version. beginning chapters specialize in equipment modeling, built-in circuit know-how, and structure, when later chapters cross directly to disguise noise and mismatch, and research and layout of the fundamental development blocks of analog circuits, comparable to present mirrors, voltage references, voltage amplifiers, and operational amplifiers.
Amorphous fabrics vary considerably from their crystalline opposite numbers in different ways in which create designated concerns of their use. This ebook explores those matters and their implications, and offers an entire therapy of either experimental and theoretical reviews within the box. Advances in Amorphous Semiconductors covers quite a lot of reviews on hydrogenated amorphous silicon, amorphous chalcogenides, and a few oxide glasses.
- CMOS SRAM Circuit Design and Parametric Test in Nano-Scaled Technologies: Process-Aware SRAM Design and Test (Frontiers in Electronic Testing)
- Nitride Semiconductor Devices: Fundamentals and Applications
- 50 Years in the Semiconductor Underground
- Silicon-On-Insulator (SOI) Technology: Manufacture and Applications (Woodhead Publishing Series in Electronic and Optical Materials)
- Modeling, Characterization and Production of Nanomaterials: Electronics, Photonics and Energy Applications (Woodhead Publishing Series in Electronic and Optical Materials)
Extra resources for System on Package: Miniaturization of the Entire System
MEMS SOP A parts synthesis approach (PSA) for 3D integration of MEMS and microsystems leading to system-on-package has been developed at Malaviya National Institute of Technology, in Jaipur, India. This eliminates the interconnection-related problems that arise when MEMS and its associated circuitry are packaged separately. Amkor has developed solutions that combine multiple chips, MEMS devices, and passives into one package. These solutions are aimed at reducing the cost of MEMS packaging and increasing functionality through greater levels of integration.