System on Package: Miniaturization of the Entire System by Rao Tummala

By Rao Tummala

System-on-Package (SOP) is an rising microelectronic expertise that locations a complete process on a unmarried chip-size package deal. the place “systems” was cumbersome bins housing countless numbers of parts, SOP saves interconnection time and warmth iteration by means of retain an entire method with computing, communications, and client features all in one chip. Written by means of the Georgia Tech builders of the expertise, this booklet explains the elemental parameters, layout features, and production concerns, displaying digital designers how this radical new packaging expertise can be utilized to resolve urgent electronics layout demanding situations.

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165–169. 10. S. S. , 2003, pp. 613–620. com). Copyright ©2004 The McGraw-Hill Companies. All rights reserved. Any use is subject to the Terms of Use as given at the website.

MEMS SOP A parts synthesis approach (PSA) for 3D integration of MEMS and microsystems leading to system-on-package has been developed at Malaviya National Institute of Technology, in Jaipur, India. This eliminates the interconnection-related problems that arise when MEMS and its associated circuitry are packaged separately. Amkor has developed solutions that combine multiple chips, MEMS devices, and passives into one package. These solutions are aimed at reducing the cost of MEMS packaging and increasing functionality through greater levels of integration.

31 SOP technology in production at Motorola. 31). Its first generation of RF capacitor passives was used in its cell phones in the 1999 time frame. The second generation of passives was improved for not only capacitance density but also for process tolerances around 2002. Ferroelectric thin film capacitors are under development in Motorola. 32 SOP implementation in Intel’s WLAN and wireless WiFi link cards. com). Copyright ©2004 The McGraw-Hill Companies. All rights reserved. Any use is subject to the Terms of Use as given at the website.

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